Aluminum substrate thermal insulation layer

The aluminum substrate thermal insulation layer refers to the insulating material layer between the heating wires or between the heating wires and the ground shielding layer, and is mainly used for isolating the wires to prevent people from being injured by electric shock. It is composed of a polymer (mainly epoxy resin) filled with high thermal conductivity and high insulation ceramic powder, and has good thermal conductivity, insulation and bonding properties. The thickness is generally 75 μm, 100 μm, 125 μm and 150 μm, of which 75 μm is a mainstream product in current aluminum substrates.

The aluminum substrate thermal insulation layer is also the largest thermal barrier in the power module structure. The better the thermal conductivity of the insulating layer, the more favorable the diffusion of heat generated during the operation of the device, the more favorable it is to reduce the operating temperature of the device, thereby increasing the power load of the module, reducing the volume, extending the life, and improving the power output. purpose.