some problems encountered in the processing of PCB Circuit board

               some problems encountered in the processing of PCB Circuit board

When manufacturing the finished plate usually appear a lot of problems, such as why warping, printed circuit board is used by base-board(sheet)why warp, mainly is the thickness of the plate is too thin and proper protection etc. of course can also be in the process of PCB circuit board processing , because of the thermal stress, and other chemical factors, as well as the improper production technology and so on caused by the printed circuit board to produce warp. In order to prevent the limited inventory due to improper way or increase the warp of the base-board，our company has take some relevant measurement

1、When copper plate in storage, due to it is moisture will make the plate warped, in largely, the moisture absorption area of the single side copper board is larger, So the inventory environment of humidity requirement are high, of course double side board and multi-side board moisture will also make the board warped

2、For the way the plate placement is also very important, if the random placement discard will increase the bending deformation of copper plate

Please contact me if you need anything

TEL:15696407315

EMILL:tcx@fpc-pcb.com