About the reason why the solder pad on the circuit board is not tin ?

About the reason why the solder pad on the circuit board is not tin ?

I think the manufacturing of circuit board is relatively complicated for the products I know so far. For example, it is not easy to add tin to the welding pad in the early stage of plate making. If the circuit board is found after the production of solder pad tin and other conditions, the cause is generally those?

1. Reasons for the design of engineering data

Each type of PCB circuit board is designed differently to meet the needs of customers, so the work of the engineering department is very important. Once there is a problem, it will cause great trouble to the subsequent production. Therefore, there are many problems to be considered in the design of the surface pad. If there is a problem in the connection mode of the pad with the copper, the pad will not be sufficiently heated when heated, and it is better to cause the pad not to be covered with tin.

2. Wrong operation by construction personnel

When operating the machine, the operator should adjust the power, temperature and welding method. If the operation is wrong, there will be problems

3. There is something wrong with the storage mode of board CARDS

According to the board card surface treatment is different, the storage method is not the same, such as some board is OSP, gold, HAL, etc., The shelf life of the HAL circuit board is about one week

, OSP circuit board surface treatment process stored in 3 months, if it is gold multilayer circuit board can be long-term preservation.

The above is some basic problems that need to be paid attention to in the manufacturing process of PCB I analyzed. If you want to know or need, please contact us: shenzhen tongchuangxin electronics co., LTD

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